350°C hotends. 65°C active chamber.
Closed-loop heat control helps limit warping and improves layer bonding with engineering polymers. Enhanced toolhead cooling supports stable performance during long production runs.
| Technology | FDM (Fused Deposition Modeling) |
Print volume (L x W x H) |
Single Nozzle Printing: 325*320*325 mm³ |
Printing Speed |
Max Speed of Toolhead: 1000 mm/s |
| Technology | FDM (Fused Deposition Modeling) |
Print volume (L x W x H) |
Single Nozzle Printing: 325*320*325 mm³ |
Printing Speed |
Max Speed of Toolhead: 1000 mm/s |
Filament diameter |
1.75 mm |
Nozzle diameter |
0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm |
Extruder |
All metal |
Extruder Gear |
Hardened Steel |
Nozzle |
Tungsten Carbide |
Châssis |
Aluminum and Steel |
Outer Frame |
Plastic and Glass |
Heatbed | |
Build Plate Material |
Flexible Steel Plate |
Included Build Plate Type |
Textured PEI Plate |
Supported Build Plate Type |
Textured PEI plate, Smooth PEI Plate |
Air Filter |
G3 Pre-Filter |
Camera Integrated camera inside the machine |
Live View Camera: 1920*1080 |
Sensorrs |
Door Sensor |
Filaments |
Optimal: PLA, PETG, TPU, PVA, BVOH Superior: ABS, ASA, PC, PA, PET, PLA renforcé de fibres de carbone/verre, PETG, PA, PET, PC, ABS, ASA Ideal: PPA-CF/GF, PPS, PPS-CF/GF |
Temperature |
|
Max extruder temperature |
350 °C |
Max room temperature |
65 °C |
Max heating plate temperature |
120 °C |
Connectivity / Software |
|
Connectivity |
Wi-Fi / Live Camera |
Slicer |
Bambu Studio |
Supported Operating System |
MacOS, Windows |
| Network Control |
|
| Ethernet | Disponible |
| Wireless Network | Wi-Fi |
| Network Kill Switch | Wi-Fi et Ethernet |
| Removable Network Module | Available |
| 802.1X Network Access Control | Available |
| Wi-Fi | |
| Operating Frequency |
2412–2472 MHz, 5150–5850 MHz (FCC/CE) 2400–2483,5 MHz, 5150–5850 MHz (SRRC) |
| Wi-Fi Transmitter Power (EIRP) | 2.4 GHz: <23 dBm (FCC); <20 dBm (CE/SRRC/MIC) 5 GHz Band1/2: <23 dBm (FCC/CE/SRRC/MIC) 5 GHz Band3: <30 dBm (CE); <24 dBm (FCC) 5 GHz Band4: <23 dBm (FCC/SRRC); <14 dBm (CE) |
| Wi-Fi Protocol | IEEE 802.11 a/b/g/n |
| Ethernet | |
| Port Type | RJ45 |
| Speed | 100 Mbps Full-Duplex |
| Others | |
| Printer dimensions | 492 x 514 x 626 mm³ |
| Poids net | 31 kg |
The H2D Pro combines high-temperature dual-nozzle printing, an actively heated chamber and enterprise-ready connectivity for demanding professional workflows.
Closed-loop heat control helps limit warping and improves layer bonding with engineering polymers. Enhanced toolhead cooling supports stable performance during long production runs.
Combine flexible and rigid materials, or reserve one nozzle for dedicated support material. The dual-nozzle workflow reduces purging, reloading and unnecessary material changes.
Tungsten carbide nozzles and the high-temperature platform support abrasive, fibre-reinforced engineering materials including PPA-CF, PPS and PPS-CF.


Ethernet, WPA2-Enterprise Wi-Fi and a physical network switch give IT teams practical options for controlled deployment in companies, laboratories and educational environments.
Adaptive air circulation, enhanced toolhead cooling and HEPA filtration help manage chamber temperature and airborne particles during demanding prints.
We help validate materials, workflow requirements, installation and network integration before deployment.
